As the core interface for Intel's 6th to 10th generation Core processors, the LGA 1151 platform covers a full range of products from entry-level Celeron to flagship i9 processors. Its cooling needs exhibit distinct hierarchical characteristics:
Basic Office Scenarios: Processors like the i3-7100 and i5-8400 with a 65W TDP require daily multitasking handling, demanding a balance between quiet operation and cooling efficiency.
Gaming and Creative Scenarios: High-performance processors such as the i7-8700K and i9-9900K can exceed 150W in overclocked states, imposing strict requirements on the extreme cooling capacity of radiators.
Special Application Scenarios: Mini-PCs like the ASRock DeskMini 110 require efficient cooling within a height limit of 46mm, driving innovations in cooler technology.
Technologically, the LGA 1151 platform evolved from thermal paste to soldered TIM (thermal interface material). For example, the soldered i7-8700K reduces thermal resistance by 30%, but it demands higher precision in contact area and pressure control from coolers. GAMEMAX addresses this with optimized mounting brackets in both air and liquid coolers to ensure uniform pressure distribution and enhanced heat dissipation.
Heat Pipe and Fin Technology
Direct-Touch Technology: Entry-level models like the Gamma 200 RGB use copper-base direct-touch heat pipes. Four 6mm heat pipes directly contact the CPU surface, reducing thermal resistance while lowering costs. 实测 shows a 12% improvement in heat conduction efficiency compared to traditional welded processes.
Multi-Heat Pipe Enhancement: The flagship Sigma 550 Infinity BK features five 6mm heat pipes and a 220W heat dissipation design. Optimized heat pipe spacing (8mm fin spacing) increases fin utilization to 92%, ideal for high-heat processors like the i9-9900K.
Fan and Airflow Design
Quiet-Efficiency Balance: The Ice Wind series employs 120mm PWM fans with hydraulic bearings, controlling noise below 23dB while providing 55 CFM airflow, suitable for quiet office and light gaming needs.
High-Pressure Airflow Optimization: The 130mm high-airflow fan of the Sigma 540 BK uses scythe-shaped blades to achieve 78 CFM at 2000RPM. A 15° fin angle optimization enhances vertical airflow efficiency in tower coolers.
Compatibility and Installation Design
All models support Intel LGA 115X/1200/1700/1851 and AMD AM4/AM5 platforms with tool-free mounting kits. The Ice Surface BK, designed for ITX cases, features a ultra-thin 47mm height, compatible with mini-PCs like the ASRock DeskMini, with installation precision controlled within ±0.5mm.
| Model | Heat Dissipation Capacity | Number of Heat Pipes | Fan Speed Range | Noise Level | Application Scenarios |
|---|---|---|---|---|---|
| Gamma 90 BK | 150W | 4x6mm | 800-1900RPM | 25dB | Entry-level office, light gaming |
| Sigma 520 | 220W | 4x6mm | 600-2000RPM | 28dB | Mainstream gaming, creative design |
| Sigma 550 | 240W | 5x6mm | 500-2200RPM | 30dB | Overclocking, extreme performance |
Cold Plate and Pump Design
Micro-Channel Technology: The Hanbing 240 uses 0.1mm micro-channels, tripling the heat dissipation area compared to traditional designs. Combined with a copper direct-touch base, it rapidly transfers CPU heat.
Magnetic Levitation Pump: The Iceburg series employs magnetic levitation bearings, extending pump life to 70,000 hours with noise below 20dB and a high flow rate of 1.8L/min.
Radiator and Fan Technology
Aluminum Radiator: The 240mm radiator of the Hanbing 240 features high-density aluminum fins. Paired with 14cm quiet fans, it achieves 72.3 CFM at 2000RPM while controlling noise under 25dB.
ARGB Integration: The Iceburg series cold plate includes 6 LED beads supporting 16.8 million color synchronization. Scythe-shaped fan blades enhance both cooling efficiency and visual appeal.
Compatibility and Installation Design
All liquid coolers support Intel LGA 115X/1200/1700/1851 and AMD AM4/AM5 platforms with dedicated LGA 1151 brackets. The Hanbing 240’s 27mm-thick radiator supports front or top mounting in most mid-tower cases.
| Model | Radiator Size | Heat Dissipation Capacity | Fan Speed Range | Noise Level | Application Scenarios |
|---|---|---|---|---|---|
| Hanbing 120 | 120mm | 200W | 800-2000RPM | 28dB | Mainstream gaming, creative design |
| Hanbing 240 | 240mm | 300W | 600-1800RPM | 25dB | Overclocking, extreme performance |
| Iceburg 360 | 360mm | 350W | 500-2200RPM | 23dB | Flagship overclocking, professional workstations |
Recommendation: Gamma 90 BK
Key Features: 4x6mm heat pipes, 120mm ARGB fan, 150W capacity, 40,000-hour hydraulic bearings.
Test Data: 68℃ under full load for i5-7500, 22dB noise.
Compatibility: Mini-PCs like Lenovo M710q, suitable for small spaces with 下压式 airflow.
Recommendation: Sigma 520 Digital BK
Key Features: 4 heat pipes, ARGB lighting, 220W capacity, 130mm high-pressure fan.
Test Data: 78℃ at 5.0GHz overclock for i7-9700K, 25.6dB noise.
Compatibility: Mid-tower cases (e.g., Huntkey Night Hunter 5), supports ARGB synchronization.
Recommendation: Hanbing 240
Key Features: 240mm radiator, 3rd-gen Asetek pump, dedicated LGA 1151 bracket.
Test Data: 82℃ at 5.2GHz overclock for i9-9900K, 28dB noise.
Compatibility: Full-tower cases (e.g., Phanteks Enthoo Elite), front-mounted radiator for optimized airflow.
Recommendation: Ice Wind
Key Features: 6 heat pipes, 14cm quiet fan, PWM intelligent speed control.
Test Data: 62℃ under full load for i5-10400F, 18dB noise.
Compatibility: Office environments (e.g., Dell OptiPlex 7090), low-noise design for productivity.
Thermal Paste Application: Use the "X" method with 0.2-0.3g paste to avoid overflow.
Pressure Control: Use a torque screwdriver with 1.5-2.0N·m for LGA 1151 to ensure uniform pressure.
Airflow Design: Front intake, rear exhaust for vertical airflow optimization.
Cleaning: Dust fins with compressed air every 6 months; deep clean annually.
Thermal Paste Replacement: Refresh every 1-2 years with options like Shin-Etsu 7921 or Bearing King.
Fan Maintenance: Check bearing lubrication and use WD-40 to extend lifespan.
| Problem | Possible Cause | Solution |
|---|---|---|
| Abnormal Temperature Rise | Dried thermal paste | Clean and reapply paste |
| Fan Noise | Worn bearings | Replace fan or add lubricant |
| Radiator Leakage | Loose fittings | Check seals and retighten |
Material Innovation: Graphene heat fins with 5000W/m·K thermal conductivity, 20x better than aluminum.
Intelligent Thermal Control: AI algorithms predict CPU load to dynamically adjust fan speed, reducing energy consumption by 30%.
Modular Design: Replaceable fins and radiators for adaptable solutions across scenarios.
GAMEMAX’s LGA 1151 cooler lineup centers on "precision scenario adaptation," balancing cost-effectiveness and performance through technical stratification and detailed optimization. Whether for quiet office users or extreme overclockers, their product matrix offers tailored solutions. With advancements in new materials and smart technology, future coolers will achieve greater breakthroughs in efficiency, noise control, and maintainability.
